The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg)
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg) https://bit.ly/4d9hD9T
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act — - Firm to get $450 million Chips Act grant, $500 million loan — Indiana facility focused on advanced packaging, research
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